The ultra-thin Ag interconnectors used for GaAs solar cell arrays applications face numerous challenges in deep space exploration missions, such as extreme temperature variations and the impact of wind and dust particles. In this study, finite element analysis was employed to investigate the effects of temperature cycling, as well as the impact of wind and dust particles. These analyses helped identify the loading modes of the GaAs cell Ag interconnectors with stress relief loops, specifically tensile-tensile fatigue and dynamic bending fatigue, and locate high-risk sites for potential failure. Subsequently, the fatigue damage behaviors of the ultra-thin Ag interconnector foils under tensile-tensile and dynamic bending fatigue tests were carefully examined. Finally, fatigue life at high-risk failure sites was quantitatively estimated based on the experimental fatigue data. The findings would have important implications for understanding fatigue damage behavior of micron-scale metal interconnector foils and for engineering design of GaAs solar cell interconnectors with long-term fatigue reliability in hash space environments.

中文翻译：

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用于深空探测的 GaAs 单元阵列中超薄 Ag 互连器的高周疲劳行为：温度循环以及风和尘埃颗粒的影响

用于 GaAs 太阳能电池阵列应用的超薄 Ag 互连器在深空探测任务中面临众多挑战，例如极端温度变化以及风和尘埃颗粒的影响。在这项研究中，采用有限元分析来研究温度循环的影响，以及风和尘埃颗粒的影响。这些分析有助于确定具有应力消除回路的 GaAs 电池 Ag 互连器的加载模式，特别是拉伸疲劳和动态弯曲疲劳，并定位潜在失效的高风险部位。随后，仔细检查了超薄 Ag 互连箔在拉伸和动态弯曲疲劳测试下的疲劳损伤行为。最后，根据实验疲劳数据定量估计高风险失效部位的疲劳寿命。这些发现对于理解微米级金属互连箔的疲劳损伤行为以及在哈希空间环境中具有长期疲劳可靠性的 GaAs 太阳能电池互连器的工程设计具有重要意义。